ARM TechCon Preview: The Multi-Core FutureARM TechCon Preview: The Multi-Core Future

From tiny devices in the Internet of Things (IoT) to giant server farms, ARM TechCon 2013 is poised to run the gamut of multi-core processing possibilities.

Housed in the Santa Clara, Calif., Convention Center from October 29-31, this year’s conference features keynotes from Bill Veghte, executive VP and GM enterprise group for HP, presenting The New Style of IT; Simon Segars, CEO of ARM discussing Transformative technology in the Internet of Things (IoT), data center and mobile; and Dr. Daniel Kraft, MD, health science innovator presenting The Future of Technology in Health and Medicine: Game-Changing Lessons For Every Industry.

If you are a chip designer, system implementation engineer or software developer, you will likely be tempted by these conference tracks:

-- Accelerating Hardware Development

-- Accelerating Software Development

-- Accelerating System Hardware Development

-- Applying New Technologies to New Opportunities

-- Creating the Next Gen Mobile Platform

-- Enhancing the User Experience

-- Marrying Software and Hardware in Multicore Design

-- Maximizing Chip Energy Efficiency

-- Next-Generation Networking – Rise of Software Defined Networking

-- Optimizing System Software Blocks

-- Stacking Up for High Performance Design

-- Taming the IoT Frontier

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